Fabrication of SiO2-based microcantilevers by anisotropic chemical etching of (100) single crystal Si
The undercutting process of thermal SiO2 microcantilevers with different orientations on (100) Si wafer was studied. The silicon substrate was removed by anisotropic chemical etching with a 25 wt. % aqueous solution of TMAH or a 30 wt. % aqueous KOH solution at 80 °C. It was found that <110> o...
Main Authors: | , , , |
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Format: | Article |
Language: | English |
Published: |
Serbian Chemical Society
2007-11-01
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Series: | Journal of the Serbian Chemical Society |
Subjects: | |
Online Access: | http://www.shd.org.yu/JSCS/Vol72/No11/JSCS_V72_No11-11.pdf |