Ultrasmooth ultrathin Ag films by AlN seeding and Ar/N2 sputtering for transparent conductive and heating applications
We report on the fabrication of 15-nm Ag films with 0.6 nm RMS roughness and only 3 times the bulk electrical resistivity using a transparent AlN seed layer and Ar/N2 (60% N2) based sputtering of Ag. Either AlN-seeding or Ar/N2 sputtering alone reduces the percolation threshold of Ag thin films and...
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2018-12-01
|
| Series: | APL Materials |
| Online Access: | http://dx.doi.org/10.1063/1.5052261 |