The Effect Of Void Formation On The Reliability Of ED-XRF Measurements In Lead-Free Reflow Soldering
In lead-free reflow soldering, the presence of voids should be taken into account. For this reason, the effect of the applied heating profiles was examined via the characterization of voids in galvanic and immersion Sn coatings. According to EU Directive 2002/95/EC, the screening of Pb element of re...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Polish Academy of Sciences
2015-06-01
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| Series: | Archives of Metallurgy and Materials |
| Subjects: | |
| Online Access: | http://www.degruyter.com/view/j/amm.2015.60.issue-2/amm-2015-0150/amm-2015-0150.xml?format=INT |