Morphological evolution and migration behavior of silver thin films on flexible substrates during thermal cycle testing

To understand morphological evolution and migration behavior caused by stress migration and thermal fatigue of silver thin films on flexible substrates, bending tests were conducted with different bending angles for two types of thermal tests. Furthermore, the effect of stress migration and thermal...

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Bibliographic Details
Main Authors: Quan Sun, Yebo Lu, Xiaobin Xu, Fengli Huang, Chengli Tang
Format: Article
Language:English
Published: SAGE Publishing 2018-08-01
Series:Advances in Mechanical Engineering
Online Access:https://doi.org/10.1177/1687814018795961