Adhesion–delamination phenomena at the interfaces of the dielectric layer
Fan-out wafer-level packaging (FOWLP) has been developed as an enhancement of standard wafer-level packaging solutions and is being intensively researched nowadays. However, issues of delamination remain unsolved. This study focuses on the interfacial characteristics between polyimide (PI) and redis...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2020-09-01
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| Series: | Results in Physics |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2211379720317162 |