Comparative analysis of modeling and experiments to study spalling process in Si wafers
A comparative analysis including modeling and experimental evaluation of a spalling process of silicon (Si) substrates was accomplished to define the optimum condition for uniform spalling. The residual stresses in Nickle (Ni) films on Si substrates have been evaluated. Different thicknesses of Ni f...
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| Format: | Article |
| Language: | English |
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AIP Publishing LLC
2017-03-01
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| Series: | AIP Advances |
| Online Access: | http://dx.doi.org/10.1063/1.4978338 |