Modeling of the ecological separation process of printed circuit boards
The content of this paper is the modeling of the stress in the printed circuit board due to the cyclic thermal stress for its ecological recycling. Cyclic thermal stresses result in separation of copper conduction paths and plastic plates due to different longitudinal expansion. For separation, it w...
| Main Authors: | , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
EDP Sciences
2018-01-01
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| Series: | MATEC Web of Conferences |
| Online Access: | https://doi.org/10.1051/matecconf/201821001004 |