Thermal Deformation Suppression Chip Based on Material Symmetry Design for Single Center Supported MEMS Devices

Thermal Deformation Suppression Chip Based on Material Symmetry Design for Single Center Supported MEMS Devices

Structural thermal deformation is an important factor that affects the performance of MEMS devices. The mismatch of thermal expansion coefficient (CTE) between different materials is a major source. For single center supported MEMS devices, expansion difference between device and the substrate leads...

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Bibliographic Details
Main Authors: Bowen Xing, Bin Zhou, Xinxi Zhang, Wenming Zhang, Bo Hou, Qi Wei, Tian Zhang, Rong Zhang
Format: Article
Language:English
Published: IEEE 2020-01-01
Series:IEEE Access
Subjects:
CTE mismatch
single center supported
material symmetry
thermal deformation suppression chip
packaging stress isolation
Online Access:https://ieeexplore.ieee.org/document/9018284/

Internet

https://ieeexplore.ieee.org/document/9018284/

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