Mechanical properties, thermal conductivity, and modeling of boron nitride-based polymer composites: A review
In the past, polymer materials have been used in electronic devices; however, the major drawback with polymers is their low thermal conductivity, i.e., 0.1–0.5 W/(m・K). Hence, researchers came up with the idea of incorporating conductive fillers into the polymer matrix in order to increase their the...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Budapest University of Technology
2021-12-01
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| Series: | eXPRESS Polymer Letters |
| Subjects: | |
| Online Access: | http://www.expresspolymlett.com/letolt.php?file=EPL-0011442&mi=cd |