Bottom-Up (Cu, Ag, Au)/Al<sub>2</sub>O<sub>3</sub>/Bi<sub>2</sub>Te<sub>3</sub> Assembled Thermoelectric Heterostructures

Bottom-Up (Cu, Ag, Au)/Al<sub>2</sub>O<sub>3</sub>/Bi<sub>2</sub>Te<sub>3</sub> Assembled Thermoelectric Heterostructures

The interface affects the transmission behavior of electrons and phonons, which in turn determines the performance of thermoelectric materials. In this paper, metals (Cu, Ag, Au)/Al<sub>2</sub>O<sub>3</sub>/Bi<sub>2</sub>Te<sub>3</sub> heterostructures...

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Bibliographic Details
Main Authors: Zhenhua Wu, Shuai Zhang, Zekun Liu, Cheng Lu, Zhiyu Hu
Format: Article
Language:English
Published: MDPI AG 2021-04-01
Series:Micromachines
Subjects:
thermoelectric
Bi<sub>2</sub>Te<sub>3</sub>
heterostructure
interface
metal
oxide
Online Access:https://www.mdpi.com/2072-666X/12/5/480

Internet

https://www.mdpi.com/2072-666X/12/5/480

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