Optimization of Copper Thermocompression Diffusion Bonding under Vacuum: Microstructural and Mechanical Characteristics
The optimization of the autogenous diffusion copper bonding via thermocompression at vacuum environment was investigated. The influence of various bonding parameters on the interdiffusion efficiency was studied in detail at the micro (SEM-EBSD) and nano (TEM) scales. Bonding at 1000 °C for...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2019-09-01
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| Series: | Metals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-4701/9/10/1044 |