Microdrilling of Through-Holes in Flexible Printed Circuits Using Picosecond Ultrashort Pulse Laser
High density and high quality interconnects are necessary for the preparation of miniaturized and lightweight electronic products. Therefore, small-diameter and high-density through-holes in FPCs (Flexible Printed Circuits) are required. However, the current processing methods cannot further decreas...
Main Authors: | , |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2018-12-01
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Series: | Polymers |
Subjects: | |
Online Access: | https://www.mdpi.com/2073-4360/10/12/1390 |