Microdrilling of Through-Holes in Flexible Printed Circuits Using Picosecond Ultrashort Pulse Laser

High density and high quality interconnects are necessary for the preparation of miniaturized and lightweight electronic products. Therefore, small-diameter and high-density through-holes in FPCs (Flexible Printed Circuits) are required. However, the current processing methods cannot further decreas...

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Bibliographic Details
Main Authors: Wanqin Zhao, Lingzhi Wang
Format: Article
Language:English
Published: MDPI AG 2018-12-01
Series:Polymers
Subjects:
Online Access:https://www.mdpi.com/2073-4360/10/12/1390