Thermomigration induced microstructure and property changes in Sn-58Bi solders
Thermomigration (TM) has become a critical reliability issue in advanced electronic packaging because of Joule heating. A temperature gradient is required to conduct heat away, and only 1 °C of temperature difference across a 10 μm thick microbump produces a temperature gradient of 1000 °C/cm, which...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2019-03-01
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| Series: | Materials & Design |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0264127519300565 |