A New Alternative Electrochemical Process for a Pre-Deposited UPD-Mn Mediated the Growth of Cu(Mn) Film by Controlling the Time during the Cu-SLRR
A layer-by-layer deposition is essential for fabricating the Cu interconnects in a nanoscale-sized microelectronics because the gap-filling capability limits the film deposition step coverage on trenches/vias. Conventional layer-by-layer electrochemical deposition of Cu typically works by using two...
Main Authors: | Jau-Shiung Fang, Yu-Fei Sie, Yi-Lung Cheng, Giin-Shan Chen |
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Format: | Article |
Language: | English |
Published: |
MDPI AG
2020-02-01
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Series: | Coatings |
Subjects: | |
Online Access: | https://www.mdpi.com/2079-6412/10/2/164 |
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