Measurement and Isolation of Thermal Stress in Silicon-On-Glass MEMS Structures
The mechanical stress in silicon-on-glass MEMS structures and a stress isolation scheme were studied by analysis and experimentation. Double-ended tuning forks (DETFs) were used to measure the stress based on the stress-frequency conversion effect. Considering the coefficients of thermal expansion (...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2018-08-01
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| Series: | Sensors |
| Subjects: | |
| Online Access: | http://www.mdpi.com/1424-8220/18/8/2603 |