Analysis of Direct Optical Ablation and Sequent Thermal Ablation for the Ultrashort Pulsed Laser Photo-Thermal Micromachining
An ultra-fast pulsed laser for materials processing can obtain submicrometer- to nanometer-sized parts or patterns (precision or accuracy) because the heat cannot diffuse in time for an ultra-fast pulsed duration, and this causes a threshold of ablation in multi-photoabsorption. The optical and ther...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-11-01
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| Series: | Coatings |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-6412/10/12/1151 |