Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the “Thermal-House”

Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the “Thermal-House”

Thermal crosstalk in a highly integrated RRAM array due to the self-heating effect is one of the most critical issues affecting device reliability. In this paper, two types of “thermal-house” structures are proposed to optimize the thermal management of the RRAM array. An in-ho...

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Bibliographic Details
Main Authors: Da-Wei Wang, Wenchao Chen, Wen-Sheng Zhao, Guo-Dong Zhu, Kai Kang, Pingqi Gao, Jose E. Schutt-Aine, Wen-Yan Yin
Format: Article
Language:English
Published: IEEE 2019-01-01
Series:IEEE Access
Subjects:
Electrothermal simulation
low power consumption
parallel simulator
resistive-switching random access memory (RRAM)
thermal-house
thermal management
Online Access:https://ieeexplore.ieee.org/document/8580571/
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spelling doaj-b51b2d22edd64dc5aa1d572f87fd4e252021-03-29T22:12:33ZengIEEEIEEE Access2169-35362019-01-0173897390810.1109/ACCESS.2018.28885728580571Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the “Thermal-House”Da-Wei Wang0https://orcid.org/0000-0001-5612-6313Wenchao Chen1Wen-Sheng Zhao2https://orcid.org/0000-0002-2507-5776Guo-Dong Zhu3Kai Kang4https://orcid.org/0000-0003-0616-2994Pingqi Gao5Jose E. Schutt-Aine6Wen-Yan Yin7Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province, College of Information Science and Electronic Engineering, Innovative Institute of Electromagnetic Information and Electronic Integration, Zhejiang University, Hangzhou, ChinaKey Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province, College of Information Science and Electronic Engineering, Innovative Institute of Electromagnetic Information and Electronic Integration, Zhejiang University, Hangzhou, ChinaSchool of Electronics and Information, Hangzhou Dianzi University, Hangzhou, ChinaKey Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province, College of Information Science and Electronic Engineering, Innovative Institute of Electromagnetic Information and Electronic Integration, Zhejiang University, Hangzhou, ChinaSchool of Electronic Engineering, University of Electronic Science and Technology, Chengdu, ChinaNingbo Institute of Material Technology and Engineering, Chinese Academy of Sciences, Ningbo, ChinaCollege of Electrical and Computer Engineering, University of Illinois at Urbana–Champaign, Urbana, IL, USAKey Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems of Zhejiang Province, College of Information Science and Electronic Engineering, Innovative Institute of Electromagnetic Information and Electronic Integration, Zhejiang University, Hangzhou, ChinaThermal crosstalk in a highly integrated RRAM array due to the self-heating effect is one of the most critical issues affecting device reliability. In this paper, two types of “thermal-house” structures are proposed to optimize the thermal management of the RRAM array. An in-house developed parallel simulator is employed to study the performance of the proposed thermal house structures in terms of resistance ratio and crosstalk temperature. It is demonstrated that the proposed thermal house structures can help to reduce thermal crosstalk in high-density RRAM arrays. Some suggestions are also provided for further improving the thermal management capability of the thermal houses as well.https://ieeexplore.ieee.org/document/8580571/Electrothermal simulationlow power consumptionparallel simulatorresistive-switching random access memory (RRAM)thermal-housethermal management
collection DOAJ
language English
format Article
sources DOAJ
author Da-Wei Wang
Wenchao Chen
Wen-Sheng Zhao
Guo-Dong Zhu
Kai Kang
Pingqi Gao
Jose E. Schutt-Aine
Wen-Yan Yin
spellingShingle Da-Wei Wang
Wenchao Chen
Wen-Sheng Zhao
Guo-Dong Zhu
Kai Kang
Pingqi Gao
Jose E. Schutt-Aine
Wen-Yan Yin
Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the “Thermal-House”
IEEE Access
Electrothermal simulation
low power consumption
parallel simulator
resistive-switching random access memory (RRAM)
thermal-house
thermal management
author_facet Da-Wei Wang
Wenchao Chen
Wen-Sheng Zhao
Guo-Dong Zhu
Kai Kang
Pingqi Gao
Jose E. Schutt-Aine
Wen-Yan Yin
author_sort Da-Wei Wang
title Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the “Thermal-House”
title_short Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the “Thermal-House”
title_full Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the “Thermal-House”
title_fullStr Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the “Thermal-House”
title_full_unstemmed Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the “Thermal-House”
title_sort fully coupled electrothermal simulation of large rram arrays in the “thermal-house”
publisher IEEE
series IEEE Access
issn 2169-3536
publishDate 2019-01-01
description Thermal crosstalk in a highly integrated RRAM array due to the self-heating effect is one of the most critical issues affecting device reliability. In this paper, two types of “thermal-house” structures are proposed to optimize the thermal management of the RRAM array. An in-house developed parallel simulator is employed to study the performance of the proposed thermal house structures in terms of resistance ratio and crosstalk temperature. It is demonstrated that the proposed thermal house structures can help to reduce thermal crosstalk in high-density RRAM arrays. Some suggestions are also provided for further improving the thermal management capability of the thermal houses as well.
topic Electrothermal simulation
low power consumption
parallel simulator
resistive-switching random access memory (RRAM)
thermal-house
thermal management
url https://ieeexplore.ieee.org/document/8580571/
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