Fully Coupled Electrothermal Simulation of Large RRAM Arrays in the “Thermal-House”
Thermal crosstalk in a highly integrated RRAM array due to the self-heating effect is one of the most critical issues affecting device reliability. In this paper, two types of “thermal-house” structures are proposed to optimize the thermal management of the RRAM array. An in-ho...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2019-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/8580571/ |