Mixed Rigid and Flexible Component Design for High-Performance Polyimide Films
To develop the polyimide (PI) which is closely matched to the coefficient of the thermal expansion (CTE) of copper, a series of PIs are prepared from 5,4′-diamino-2-phenyl benzimidazole (DAPBI), 4,4′-diaminodiphenyl ether (ODA), and 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA) using a se...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2017-09-01
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| Series: | Polymers |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2073-4360/9/9/451 |