Four-Probe Bridges for In-Line Determination of Thickness and Sidewall Etch Angle of Surface Micromachined Thin Films
Geometrical parameters, such as the thickness and the sidewall etch angle of microelectromechanical systems (MEMS) thin films, are important information for device design and simulation, material property extraction, and quality control in a fabrication process line. This paper presents an in-line t...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2018-11-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/8/12/2424 |