Research on generalized testing technology of DC-40 GHz RF microsystem in BGA package

The RF microsystem is the future development trend of electronic equipment miniaturization, and the ball grid array(BGA) is one of its common implementation forms. Because the BGA package cannot be measured by being connected to a vector network analyzer, the testing technology of the RF BGA package...

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Bibliographic Details
Main Authors: Zhang Xiaoqing, Liu Dexi, Zhu Dalong, Shi Lei, Liu Yawei
Format: Article
Language:zho
Published: National Computer System Engineering Research Institute of China 2021-01-01
Series:Dianzi Jishu Yingyong
Subjects:
Online Access:http://www.chinaaet.com/article/3000127712