Effect of CeO<sub>2</sub> Nanoparticles on Interface of Cu/Al<sub>2</sub>O<sub>3</sub> Ceramic Clad Composites
Cu/Al<sub>2</sub>O<sub>3</sub> ceramic clad composites are widely used in electronic packaging and electrical contacts. However, the conductivity and strength of the interfacial layer are not fit for the demands. So CeO<sub>2</sub> nanoparticles 24.3 nm in size, c...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-03-01
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| Series: | Materials |
| Subjects: | |
| Online Access: | https://www.mdpi.com/1996-1944/13/5/1240 |