Thermal distribution analysis of inner defects in TSV
In order to uncover the external manifestations of TSV internal defects, the finite element models of typical internal defects, which were filling missing, axial cavity and end cavity, were established. The thermal analysis was carried out using thermoelectric coupling method. The temperature distri...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
EDP Sciences
2018-01-01
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| Series: | E3S Web of Conferences |
| Online Access: | https://doi.org/10.1051/e3sconf/20183804026 |