Optimizing the Organic/Inorganic Barrier Structure for Flexible Plastic Substrate Encapsulation

Optimizing the Organic/Inorganic Barrier Structure for Flexible Plastic Substrate Encapsulation

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A multilayered barrier structure stacked with organosilicon and silicon oxide (SiOx) films consecutively prepared using plasma enhanced chemical vapor deposition (PECVD) was developed to encapsulate flexible plastic substrate. The evolution on the residual internal stress, structural quality of the...

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Bibliographic Details
Main Authors: Yi-Chiuan Lin, Quoc-Khoa Le, Li-Wei Lai, Ren-Mao Liao, Ming-Shin Jeng, Day-Shan Liu
Format: Article
Language:English
Published: Taiwan Association of Engineering and Technology Innovation 2012-07-01
Series:International Journal of Engineering and Technology Innovation
Subjects:
Multilayered barrier structure
organosilicon/SiOx
plasma-enhanced chemical vapor deposition
flexible plastic substrate
residual internal stress
adhesion
Online Access:http://ojs.imeti.org/index.php/IJETI/article/view/77

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http://ojs.imeti.org/index.php/IJETI/article/view/77

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