Optimizing the Organic/Inorganic Barrier Structure for Flexible Plastic Substrate Encapsulation
A multilayered barrier structure stacked with organosilicon and silicon oxide (SiOx) films consecutively prepared using plasma enhanced chemical vapor deposition (PECVD) was developed to encapsulate flexible plastic substrate. The evolution on the residual internal stress, structural quality of the...
Main Authors: | , , , , , |
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Format: | Article |
Language: | English |
Published: |
Taiwan Association of Engineering and Technology Innovation
2012-07-01
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Series: | International Journal of Engineering and Technology Innovation |
Subjects: | |
Online Access: | http://ojs.imeti.org/index.php/IJETI/article/view/77 |
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