A Monolithic Three-Axis Accelerometer with Wafer-Level Package by CMOS MEMS Process

A Monolithic Three-Axis Accelerometer with Wafer-Level Package by CMOS MEMS Process

This paper presents a monolithic three-axis accelerometer with wafer-level package by CMOS MEMS process. The compositions of the microstructure are selected from CMOS layers in order to suppress the in-plane and out-of-plane bending deflection caused by the residual stresses in multiple layers. A sw...

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Bibliographic Details
Main Authors: S. H. Tseng, C. Y. Yeh, A. Y. Chang, Y. J. Wang, P. C. Chen, H. H. Tsai, Y. Z. Juang
Format: Article
Language:English
Published: MDPI AG 2017-08-01
Series:Proceedings
Subjects:
monolithic
wafer-level package
CMOS MEMS
accelerometer
Online Access:https://www.mdpi.com/2504-3900/1/4/337

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https://www.mdpi.com/2504-3900/1/4/337

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