Development of high strength W/V/Au/ODS-Cu joint using HIP process

Development of high strength W/V/Au/ODS-Cu joint using HIP process

A new high strength bonding method between Tungsten (W) and Oxide Dispersion Strengthening copper (ODS-Cu) using vanadium (V) and gold (Au) inserts was investigated and the resulting joints were characterized with SEM, micro-hardness and four point bending test. For the joints using thick Au inserts...

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Bibliographic Details
Main Authors: Hiroyuki Noto, Tetsuya Yamada, Yoshimitsu Hishinuma, Takeo Muroga
Format: Article
Language:English
Published: Elsevier 2016-12-01
Series:Nuclear Materials and Energy
Subjects:
Tungsten
Plasma facing materials
Copper
Bonding
Vanadium insert
Gold insert
Online Access:http://www.sciencedirect.com/science/article/pii/S2352179115300715

Internet

http://www.sciencedirect.com/science/article/pii/S2352179115300715

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