Microstructure Formation and Resistivity Change in CuCr during Rapid Solidification

Microstructure Formation and Resistivity Change in CuCr during Rapid Solidification

The formation of the surface-near microstructure after a current interruption of CuCr contact materials in a vacuum interrupter is characterized by a fast heating and subsequently rapid solidification process. In the present article, we reveal and analyse the formation of two distinct microstructura...

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Bibliographic Details
Main Authors: Ulla Hauf, Alexander Kauffmann, Sandra Kauffmann-Weiss, Alexander Feilbach, Mike Boening, Frank E. H. Mueller, Volker Hinrichsen, Martin Heilmaier
Format: Article
Language:English
Published: MDPI AG 2017-11-01
Series:Metals
Subjects:
CuCr
supersaturation
solid solution
texture
powder metallurgy
microstructure
contact material
vacuum interrupter
heat affected volume
Online Access:https://www.mdpi.com/2075-4701/7/11/478

Internet

https://www.mdpi.com/2075-4701/7/11/478

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