The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading

The Interface Microstructure and Shear Strength of Sn2.5Ag0.7Cu0.1RExNi/Cu Solder Joints under Thermal-Cycle Loading

The interface microstructure and shear strength of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal-cycle loading were investigated with scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), X-ray diffraction (XRD) and physical and chemical tests. The results show that an inte...

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Bibliographic Details
Main Authors: Congcong Cao, Keke Zhang, Baojin Shi, Huigai Wang, Di Zhao, Mengmeng Sun, Chao Zhang
Format: Article
Language:English
Published: MDPI AG 2019-05-01
Series:Metals
Subjects:
Sn2.5Ag0.7Cu0.1RExNi lead-free solder
solder joint
thermal-cycle loading
intermetallic compounds
shear strength
Online Access:https://www.mdpi.com/2075-4701/9/5/518

Internet

https://www.mdpi.com/2075-4701/9/5/518

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