Optimization of Processing Parameters for Water-Jet-Assisted Laser Etching of Polycrystalline Silicon

Optimization of Processing Parameters for Water-Jet-Assisted Laser Etching of Polycrystalline Silicon

Liquid-assisted laser technology is used to etch defect-free materials for high-precision electronics and machinery. This study investigates water-jet-assisted laser etching of polysilicon material. The depths and widths of the etched grooves were investigated for different water-jet incident angles...

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Bibliographic Details
Main Authors: Xuehui Chen, Xiang Li, Chao Wu, Yuping Ma, Yao Zhang, Lei Huang, Wei Liu
Format: Article
Language:English
Published: MDPI AG 2019-05-01
Series:Applied Sciences
Subjects:
laser etching
water jet
polycrystalline silicon
orthogonal test
Online Access:https://www.mdpi.com/2076-3417/9/9/1882

Internet

https://www.mdpi.com/2076-3417/9/9/1882

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