Optimization of Processing Parameters for Water-Jet-Assisted Laser Etching of Polycrystalline Silicon
Liquid-assisted laser technology is used to etch defect-free materials for high-precision electronics and machinery. This study investigates water-jet-assisted laser etching of polysilicon material. The depths and widths of the etched grooves were investigated for different water-jet incident angles...
Main Authors: | Xuehui Chen, Xiang Li, Chao Wu, Yuping Ma, Yao Zhang, Lei Huang, Wei Liu |
---|---|
Format: | Article |
Language: | English |
Published: |
MDPI AG
2019-05-01
|
Series: | Applied Sciences |
Subjects: | |
Online Access: | https://www.mdpi.com/2076-3417/9/9/1882 |
Similar Items
-
Design and Research of a Color Discrimination Method for Polycrystalline Silicon Cells Based on Laser Detection System
by: Zijian Chen, et al.
Published: (2019-10-01) -
Crystallographically Determined Etching and Its Relevance to the Metal-Assisted Catalytic Etching (MACE) of Silicon Powders
by: Kurt W. Kolasinski, et al.
Published: (2019-01-01) -
Self -Phase Modulation of Silicon Nanostructure Produced by Laser Induced Etching
by: Hadeel F. Shaker, et al.
Published: (2017-01-01) -
Molecular Dynamics Simulation of Nanoscale Abrasive Wear of Polycrystalline Silicon
by: Pengzhe Zhu, et al.
Published: (2018-12-01) -
Electrochemical etch characteristics of (100) silicon in tetramethyl ammonium hydroxide
by: Watts, Paul E.
Published: (2012)