Ultra-High Light Extraction Efficiency and Ultra-Thin Mini-LED Solution by Freeform Surface Chip Scale Package Array

Ultra-High Light Extraction Efficiency and Ultra-Thin Mini-LED Solution by Freeform Surface Chip Scale Package Array

In this study, we present a novel type of package, freeform-designed chip scale package (FDCSP), which has ultra-high light extraction efficiency and bat-wing light field. For the backlight application, mainstream solutions are chip-scale package (CSP) and surface-mount device package (SMD). Compari...

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Bibliographic Details
Main Authors: Che-Hsuan Huang, Chieh-Yu Kang, Shu-Hsiu Chang, Chih-Hao Lin, Chun-Yu Lin, Tingzhu Wu, Chin-Wei Sher, Chien-Chung Lin, Po-Tsung Lee, Hao-Chung Kuo
Format: Article
Language:English
Published: MDPI AG 2019-04-01
Series:Crystals
Subjects:
chip scale package
freeform design
mini LED
light emitting diode
Online Access:https://www.mdpi.com/2073-4352/9/4/202

Internet

https://www.mdpi.com/2073-4352/9/4/202

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