Capillary forces as a limiting factor for sawing of ultrathin silicon wafers by diamond multi-wire saw
Succeeding with ultrathin silicon wafer sawing by diamond multi-wire saw, is not only a matter of optimization; the challenges of thin wafer production and the capability limit have not yet been fully understood. In this work, we have seen that regular pairing of wires occurs when the wire-wire sepa...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2020-10-01
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| Series: | Engineering Science and Technology, an International Journal |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S221509861932141X |