Low temperature Cu-Cu bonding using copper nanoparticles fabricated by high pressure PVD
Copper nanoparticles (Cu NPs) fabricated by physical vapor deposition (PVD) were introduced in Cu-Cu bonding as surface modification. The bonding structure with Ti adhesive/barrier layer and Cu substrate layer was fabricated on both surfaces first. Loose structure with Cu NPs was then deposited by m...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2017-03-01
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| Series: | AIP Advances |
| Online Access: | http://dx.doi.org/10.1063/1.4978490 |