Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions
Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reporte...
Main Authors: | , , |
---|---|
Format: | Article |
Language: | English |
Published: |
Taylor & Francis Group
2015-06-01
|
Series: | Science and Technology of Advanced Materials |
Subjects: | |
Online Access: | http://dx.doi.org/10.1088/1468-6996/16/3/033505 |