Heat Dissipation in Epoxy/Amine-Based Gradient Composites with Alumina Particles: A Critical Evaluation of Thermal Conductivity Measurements

For the design of the next generation of microelectronic packages, thermal management is one of the key aspects and must be met by the development of polymers with enhanced thermal conductivity. While all polymer classes show a very low thermal conductivity, this shortcoming can be compensated for b...

Full description

Bibliographic Details
Main Authors: Matthias Morak, Philipp Marx, Mario Gschwandl, Peter Filipp Fuchs, Martin Pfost, Frank Wiesbrock
Format: Article
Language:English
Published: MDPI AG 2018-10-01
Series:Polymers
Subjects:
Online Access:http://www.mdpi.com/2073-4360/10/10/1131