Interfacial Microstructure of FeCoNiCrAl<sub>0.1</sub> High Entropy Alloy and Pure Copper Prepared by Explosive Welding

Interfacial Microstructure of FeCoNiCrAl<sub>0.1</sub> High Entropy Alloy and Pure Copper Prepared by Explosive Welding

The FeCoNiCrAl<sub>0.1</sub> high entropy alloys (HEAs) and pure copper (Cu) composite plates were successfully fabricated by the explosive welding technique using two different gap distances. The interfacial microstructure, elemental distribution, grain structure of vortex zone and hard...

Full description

Bibliographic Details
Main Authors: Qichao Tian, Hanliang Liang, Yang Zhao, Honghao Ma, Zhaowu Shen, Yuling Sun, Ming Yang
Format: Article
Language:English
Published: MDPI AG 2020-12-01
Series:Coatings
Subjects:
high entropy alloys
copper
explosive welding
composites
interfacial microstructure
electron backscattered diffraction
Online Access:https://www.mdpi.com/2079-6412/10/12/1197

Internet

https://www.mdpi.com/2079-6412/10/12/1197

Similar Items