Electronic parameters of MIS Schottky diodes with DNA biopolymer interlayer

Electronic parameters of MIS Schottky diodes with DNA biopolymer interlayer

In this work, we prepared an ideal Cu/DNA/n-InP biopolymer-inorganic Schottky sandwich device formed by coating a n- lP semiconductor wafer with a biopolymer DNA. The Cu/DNA/n-InP contact showed a good rectifying behavior. The ideality factor value of 1.08 and the barrier height (Φb) value of 0.70 e...

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Bibliographic Details
Main Authors: Güllü Ömer, Türüt Abdulmecit
Format: Article
Language:English
Published: Sciendo 2015-09-01
Series:Materials Science-Poland
Subjects:
schottky diodes
interfaces
semiconductors
electrical properties
Online Access:https://doi.org/10.1515/msp-2015-0089

Internet

https://doi.org/10.1515/msp-2015-0089

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