Characteristics Research of the Three Dimensional Hall Magnetic Field Sensor Based on Packaging Technology
This paper presents a three dimensional (3D) magnetic field sensor composed of three Hall elements with similar characteristics. Through adopting complementary metal oxide semiconductor (CMOS) technology, the chips of Hall element were designed and fabricated on the p-type silicon substrate with hig...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IFSA Publishing, S.L.
2016-02-01
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| Series: | Sensors & Transducers |
| Subjects: | |
| Online Access: | http://www.sensorsportal.com/HTML/DIGEST/february_2016/Vol_197/P_2793.pdf |