A metal–metal bonding process using metallic copper nanoparticles produced by reduction of copper oxide nanoparticles
Metal–metal bonding was performed using metallic Cu nanoparticles fabricated from CuO nanoparticles. Colloid solutions of CuO nanoparticles were prepared by the reaction of Cu(NO3)2 and NaOH in aqueous solution at reaction temperatures (TCuOs) of 20, 40, 60 and 80 °C. CuO single crystallites with a...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2014-04-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785414000039 |