Effects of Bismuth on the Microstructure, Properties, and Interfacial Reaction Layers of Sn-9Zn-xBi Solders

Effects of Bismuth on the Microstructure, Properties, and Interfacial Reaction Layers of Sn-9Zn-xBi Solders

In electronic packaging, Sn-Zn lead-free solder has great application prospects. Sn-9Zn-xBi alloys were obtained by smelting. This paper details a systematic study of the effect of Bi on the microstructure, melting behavior, wettability, mechanical behavior, antioxidant properties, and electrical co...

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Bibliographic Details
Main Authors: Yan Zhi Peng, Cai Ju Li, Jiao Jiao Yang, Jia Tao Zhang, Ju Bo Peng, Guang Ji Zhou, Cun Ji Pu, Jian Hong Yi
Format: Article
Language:English
Published: MDPI AG 2021-03-01
Series:Metals
Subjects:
microstructure
lead-free
solder alloy
oxidation resistance
intermetallic
Online Access:https://www.mdpi.com/2075-4701/11/4/538

Internet

https://www.mdpi.com/2075-4701/11/4/538

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