Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires

Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires

A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). However, TGVs are challenging to realize because via holes in gl...

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Bibliographic Details
Main Authors: Miku J. Laakso, Simon J. Bleiker, Jessica Liljeholm, Gustaf E. Martensson, Mikhail Asiatici, Andreas C. Fischer, Goran Stemme, Thorbjorn Ebefors, Frank Niklaus
Format: Article
Language:English
Published: IEEE 2018-01-01
Series:IEEE Access
Subjects:
Chip scale packaging
femtosecond laser
glass interposer
laser ablation
multichip modules
robotic assembly
Online Access:https://ieeexplore.ieee.org/document/8424149/

Internet

https://ieeexplore.ieee.org/document/8424149/

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