Uniaxial tensile and shear deformation tests of gold–tin eutectic solder film
This paper describes a novel experimental technique for measuring mechanical properties of gold-tin (Au–Sn) eutectic solder film used for soldering package in microelectromechanical systems (MEMS). Dual-source DC magnetron sputtering was employed to deposit Au-20 weight % (wt%) Sn film. The tensile...
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| Format: | Article |
| Language: | English |
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Taylor & Francis Group
2007-01-01
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| Series: | Science and Technology of Advanced Materials |
| Online Access: | http://www.iop.org/EJ/abstract/1468-6996/8/3/A04 |