Large-Signal Simulation of 94 GHz Pulsed Silicon DDR IMPATTs Including the Temperature Transient Effect

In this paper large-signal modeling and simulation has been carried to study the frequency chirping due to temperature transients and the large-signal power and efficiency of pulsed silicon Double-Drift Region (DDR) Impact Avalanche Transit Time (IMPATT) device operating at 94 GHz. A large-signal si...

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Main Authors: A. Acharyya, S. Banerjee, J. P. Banerjee
Format: Article
Language:English
Published: Spolecnost pro radioelektronicke inzenyrstvi 2012-12-01
Series:Radioengineering
Subjects:
Online Access:http://www.radioeng.cz/fulltexts/2012/12_04_1218_1225.pdf
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spelling doaj-cdc3b682adb34195b9b7b567a2979ae02020-11-24T23:51:52ZengSpolecnost pro radioelektronicke inzenyrstviRadioengineering1210-25122012-12-0121412181225Large-Signal Simulation of 94 GHz Pulsed Silicon DDR IMPATTs Including the Temperature Transient EffectA. AcharyyaS. BanerjeeJ. P. BanerjeeIn this paper large-signal modeling and simulation has been carried to study the frequency chirping due to temperature transients and the large-signal power and efficiency of pulsed silicon Double-Drift Region (DDR) Impact Avalanche Transit Time (IMPATT) device operating at 94 GHz. A large-signal simulation method based on non-sinusoidal voltage excitation incorporating the transient thermal effect has been developed by the authors. Results show that the device is capable of delivering a peak pulsed power output of 17.5 W with 12.8% efficiency when the voltage modulation is 60%. The maximum junction temperature rise is 350.2 K for a peak pulsed bias current of 6.79 A with 100 ns pulsewidth and 0.5 percent duty cycle; whereas the chirp bandwidth is 8.3 GHz.www.radioeng.cz/fulltexts/2012/12_04_1218_1225.pdfChirp bandwidthfrequency chirpinglarge-signal simulationpulsed DDR IMPATTtemperature transients
collection DOAJ
language English
format Article
sources DOAJ
author A. Acharyya
S. Banerjee
J. P. Banerjee
spellingShingle A. Acharyya
S. Banerjee
J. P. Banerjee
Large-Signal Simulation of 94 GHz Pulsed Silicon DDR IMPATTs Including the Temperature Transient Effect
Radioengineering
Chirp bandwidth
frequency chirping
large-signal simulation
pulsed DDR IMPATT
temperature transients
author_facet A. Acharyya
S. Banerjee
J. P. Banerjee
author_sort A. Acharyya
title Large-Signal Simulation of 94 GHz Pulsed Silicon DDR IMPATTs Including the Temperature Transient Effect
title_short Large-Signal Simulation of 94 GHz Pulsed Silicon DDR IMPATTs Including the Temperature Transient Effect
title_full Large-Signal Simulation of 94 GHz Pulsed Silicon DDR IMPATTs Including the Temperature Transient Effect
title_fullStr Large-Signal Simulation of 94 GHz Pulsed Silicon DDR IMPATTs Including the Temperature Transient Effect
title_full_unstemmed Large-Signal Simulation of 94 GHz Pulsed Silicon DDR IMPATTs Including the Temperature Transient Effect
title_sort large-signal simulation of 94 ghz pulsed silicon ddr impatts including the temperature transient effect
publisher Spolecnost pro radioelektronicke inzenyrstvi
series Radioengineering
issn 1210-2512
publishDate 2012-12-01
description In this paper large-signal modeling and simulation has been carried to study the frequency chirping due to temperature transients and the large-signal power and efficiency of pulsed silicon Double-Drift Region (DDR) Impact Avalanche Transit Time (IMPATT) device operating at 94 GHz. A large-signal simulation method based on non-sinusoidal voltage excitation incorporating the transient thermal effect has been developed by the authors. Results show that the device is capable of delivering a peak pulsed power output of 17.5 W with 12.8% efficiency when the voltage modulation is 60%. The maximum junction temperature rise is 350.2 K for a peak pulsed bias current of 6.79 A with 100 ns pulsewidth and 0.5 percent duty cycle; whereas the chirp bandwidth is 8.3 GHz.
topic Chirp bandwidth
frequency chirping
large-signal simulation
pulsed DDR IMPATT
temperature transients
url http://www.radioeng.cz/fulltexts/2012/12_04_1218_1225.pdf
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