On the evolution of microstructure and fracture behavior of multilayered copper sheet fabricated by accumulative roll bonding
In this investigation, multi-layer copper sheets are fabricated using accumulative roll bonding (ARB). Evolution of microstructure and dislocation density during ARB and after that during annealing treatment at 500 °C are investigated. In addition, the evolution of voids at the interfaces between st...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2021-01-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785420320871 |