Critical conditions and grain growth model for dynamic recrystallization of Cu-Ni-Si alloy
Hot compression tests of Cu-Ni-Si alloy with high Ni and Si contents were performed at the deformation temperatures of 750–950 °C, and the strain rates of 0.01–10 s−1 on a Gleeble-3800 thermo-mechanical simulator. The critical conditions for dynamic recrystallization (DRX) of Cu-Ni-Si alloy were obt...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2019-12-01
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| Series: | Results in Physics |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2211379719305170 |