Critical conditions and grain growth model for dynamic recrystallization of Cu-Ni-Si alloy

Hot compression tests of Cu-Ni-Si alloy with high Ni and Si contents were performed at the deformation temperatures of 750–950 °C, and the strain rates of 0.01–10 s−1 on a Gleeble-3800 thermo-mechanical simulator. The critical conditions for dynamic recrystallization (DRX) of Cu-Ni-Si alloy were obt...

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Main Authors:	Jinlong Zhang, Zhenlin Lu, Lei Jia, Hui Xie, Shiping Tao, Xin Wei, Ying Ma
Format:	Article
Language:	English
Published:	Elsevier 2019-12-01
Series:	Results in Physics
Online Access:	http://www.sciencedirect.com/science/article/pii/S2211379719305170

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spelling	doaj-d0aa5c21656e4beaa05ec88f86bc96952020-11-25T02:53:17ZengElsevierResults in Physics2211-37972019-12-0115Critical conditions and grain growth model for dynamic recrystallization of Cu-Ni-Si alloyJinlong Zhang0Zhenlin Lu1Lei Jia2Hui Xie3Shiping Tao4Xin Wei5Ying Ma6School of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710084, China; School of Materials Engineering, Xi’an Aeronautical University, Xi’an 710077, ChinaSchool of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710084, China; Corresponding author.School of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710084, ChinaSchool of Materials Engineering, Xi’an Aeronautical University, Xi’an 710077, ChinaSchool of Materials Engineering, Xi’an Aeronautical University, Xi’an 710077, ChinaSchool of Materials Engineering, Xi’an Aeronautical University, Xi’an 710077, ChinaSchool of Materials Engineering, Xi’an Aeronautical University, Xi’an 710077, ChinaHot compression tests of Cu-Ni-Si alloy with high Ni and Si contents were performed at the deformation temperatures of 750–950 °C, and the strain rates of 0.01–10 s−1 on a Gleeble-3800 thermo-mechanical simulator. The critical conditions for dynamic recrystallization (DRX) of Cu-Ni-Si alloy were obtained by processing the collected data and combining with the inflection point of θ-σ curve with the minimum value criterion of −∂θ/∂σ-σ curve. There was a certain correlation between the critical strain (εc) and the peak strain (εp), that was, εc/εp = 0.723, and the functional relationship between εc and Z parameter was εc = 1.05 × 10−3Z0.059. The average recrystallized grain size under various deformation conditions was measured, and the DRX grain growth model of Cu-Ni-Si alloy was established as dDRX = 5650.4ε̇−0.12891exp(−73142/RT). Keywords: Cu-Ni-Si alloy, Dynamic recrystallization, Critical condition, Grain growth modelhttp://www.sciencedirect.com/science/article/pii/S2211379719305170
collection	DOAJ
language	English
format	Article
sources	DOAJ
author	Jinlong Zhang Zhenlin Lu Lei Jia Hui Xie Shiping Tao Xin Wei Ying Ma
spellingShingle	Jinlong Zhang Zhenlin Lu Lei Jia Hui Xie Shiping Tao Xin Wei Ying Ma Critical conditions and grain growth model for dynamic recrystallization of Cu-Ni-Si alloy Results in Physics
author_facet	Jinlong Zhang Zhenlin Lu Lei Jia Hui Xie Shiping Tao Xin Wei Ying Ma
author_sort	Jinlong Zhang
title	Critical conditions and grain growth model for dynamic recrystallization of Cu-Ni-Si alloy
title_short	Critical conditions and grain growth model for dynamic recrystallization of Cu-Ni-Si alloy
title_full	Critical conditions and grain growth model for dynamic recrystallization of Cu-Ni-Si alloy
title_fullStr	Critical conditions and grain growth model for dynamic recrystallization of Cu-Ni-Si alloy
title_full_unstemmed	Critical conditions and grain growth model for dynamic recrystallization of Cu-Ni-Si alloy
title_sort	critical conditions and grain growth model for dynamic recrystallization of cu-ni-si alloy
publisher	Elsevier
series	Results in Physics
issn	2211-3797
publishDate	2019-12-01
description	Hot compression tests of Cu-Ni-Si alloy with high Ni and Si contents were performed at the deformation temperatures of 750–950 °C, and the strain rates of 0.01–10 s−1 on a Gleeble-3800 thermo-mechanical simulator. The critical conditions for dynamic recrystallization (DRX) of Cu-Ni-Si alloy were obtained by processing the collected data and combining with the inflection point of θ-σ curve with the minimum value criterion of −∂θ/∂σ-σ curve. There was a certain correlation between the critical strain (εc) and the peak strain (εp), that was, εc/εp = 0.723, and the functional relationship between εc and Z parameter was εc = 1.05 × 10−3Z0.059. The average recrystallized grain size under various deformation conditions was measured, and the DRX grain growth model of Cu-Ni-Si alloy was established as dDRX = 5650.4ε̇−0.12891exp(−73142/RT). Keywords: Cu-Ni-Si alloy, Dynamic recrystallization, Critical condition, Grain growth model
url	http://www.sciencedirect.com/science/article/pii/S2211379719305170
work_keys_str_mv	AT jinlongzhang criticalconditionsandgraingrowthmodelfordynamicrecrystallizationofcunisialloy AT zhenlinlu criticalconditionsandgraingrowthmodelfordynamicrecrystallizationofcunisialloy AT leijia criticalconditionsandgraingrowthmodelfordynamicrecrystallizationofcunisialloy AT huixie criticalconditionsandgraingrowthmodelfordynamicrecrystallizationofcunisialloy AT shipingtao criticalconditionsandgraingrowthmodelfordynamicrecrystallizationofcunisialloy AT xinwei criticalconditionsandgraingrowthmodelfordynamicrecrystallizationofcunisialloy AT yingma criticalconditionsandgraingrowthmodelfordynamicrecrystallizationofcunisialloy
_version_	1724725525876834304

Critical conditions and grain growth model for dynamic recrystallization of Cu-Ni-Si alloy

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