3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer

3-Axis Fully-Integrated Capacitive Tactile Sensor with Flip-Bonded CMOS on LTCC Interposer

This paper reports a 3-axis fully integrated differential capacitive tactile sensor surface-mountable on a bus line. The sensor integrates a flip-bonded complementary metal-oxide semiconductor (CMOS) with capacitive sensing circuits on a low temperature cofired ceramic (LTCC) interposer with Au thro...

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Bibliographic Details
Main Authors: Sho Asano, Masanori Muroyama, Takahiro Nakayama, Yoshiyuki Hata, Yutaka Nonomura, Shuji Tanaka
Format: Article
Language:English
Published: MDPI AG 2017-10-01
Series:Sensors
Subjects:
3-axis tactile sensor
MEMS-CMOS integration
capacitive sensor
Au-Au thermo-compression bonding
low temperature cofired ceramic
Online Access:https://www.mdpi.com/1424-8220/17/11/2451

Internet

https://www.mdpi.com/1424-8220/17/11/2451

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