A Modified Interposer Fabrication Process by Copper Nano-Pillars Filled in Anodic Aluminum Oxide Film for 3D Electronic Package
Though copper nano-pillars (CNPs) filled in anodic aluminum oxide (AAO) film has been developed for many years, the high pore-filling percentage in AAO is still a bottleneck. We have demonstrated a new electrodeposition method to fill CNPs in AAO without the seed layer which is required in the tradi...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2018-11-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/8/11/2188 |