Acoustic aspects of synthetic jet generated by acoustic actuator
Thermal overstressing as a result of miniaturization is the foremost challenge for the next generation electronic devices. Shrinking size of electronic devices makes this problem even worse. Conventional cooling module which uses fan and a heat sink seems to be inadequate for cooling of electronic d...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
SAGE Publishing
2018-03-01
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| Series: | Journal of Low Frequency Noise, Vibration and Active Control |
| Online Access: | https://doi.org/10.1177/1461348418757879 |